Measuring the Stress Dependence of Nucleation and Growth Processes in Sn Whisker Formation

Significance of Nucleation Kinetics in Sn Whisker Formation

(2014) E. Chason et al.   JOURNAL OF ELECTRONIC MATERIALS

Kinetics of Sn whisker nucleation using thermally induced stress

(2014) F. Pei et al.   SCRIPTA MATERIALIA

Whisker and hillock growth via coupled localized Coble creep, grain boundary sliding, and shear induced grain boundary migration

(2013) P. Sarobol et al.   ACTA MATERIALIA

In Situ Measurement of Stress and Whisker/Hillock Density During Thermal Cycling of Sn Layers

(2013) Fei Pei et al.   JOURNAL OF ELECTRONIC MATERIALS

Recrystallization as a nucleation mechanism for whiskers and hillocks on thermally cycled Sn-alloy solder films

(2013) P. Sarobol et al.   MATERIALS LETTERS

Growth of whiskers from Sn surfaces: Driving forces and growth mechanisms

(2013) Eric Chason et al.   PROGRESS IN SURFACE SCIENCE

Correlating whisker growth and grain structure on Sn-Cu samples by real-time scanning electron microscopy and backscattering diffraction characterization

(2012) Fei Pei et al.   APPLIED PHYSICS LETTERS

Correlation Between Surface Morphology Evolution and Grain Structure: Whisker/Hillock Formation in Sn-Cu

(2012) Fei Pei et al.   JOM

Altering the Mechanical Properties of Sn Films by Alloying with Bi: Mimicking the Effect of Pb to Suppress Whiskers

(2012) Nitin Jadhav et al.   JOURNAL OF ELECTRONIC MATERIALS

Effect of Crystal Orientation on Mechanically Induced Sn Whiskers on Sn-Cu Plating

(2012) Yukiko Mizuguchi et al.   JOURNAL OF ELECTRONIC MATERIALS

A kinetic analysis of residual stress evolution in polycrystalline thin films

(2012) Eric Chason   THIN SOLID FILMS

Controlled positions and kinetic analysis of spontaneous tin whisker growth

(2011) Chien-Hao Su et al.   APPLIED PHYSICS LETTERS

Tin whisker analysis of Toyota's electronic throttle controls

(2011) Bhanu Sood et al.   CIRCUIT WORLD

Whisker Formation Induced by Component and Assembly Ionic Contamination

(2011) Polina Snugovsky et al.   JOURNAL OF ELECTRONIC MATERIALS

Interface flow mechanism for tin whisker growth

(2010) H.P. Howard et al.   ACTA MATERIALIA

Defect Morphology and Texture in Sn, Sn–Cu, and Sn–Cu–Pb Electroplated Films

(2010) Pylin Sarobol et al.   IEEE TRANSACTIONS ON ELECTRONICS PACKAGING MANUFACTURING

Real-time SEM/FIB studies of whisker growth and surface modification

(2010) Nitin Jadhav et al.   JOM

Local, submicron, strain gradients as the cause of Sn whisker growth

(2009) M. Sobiech et al.   APPLIED PHYSICS LETTERS

Dynamic Recrystallization (DRX) as the Mechanism for Sn Whisker Development. Part II: Experimental Study

(2009) P. T. Vianco et al.   JOURNAL OF ELECTRONIC MATERIALS

Dynamic Recrystallization (DRX) as the Mechanism for Sn Whisker Development. Part I: A Model

(2009) P. T. Vianco et al.   JOURNAL OF ELECTRONIC MATERIALS

Whisker formation in Sn and Pb–Sn coatings: Role of intermetallic growth, stress evolution, and plastic deformation processes

(2008) E. Chason et al.   APPLIED PHYSICS LETTERS