Ni doping on Cu surfaces: Reduced copper resistivity

A Proposal for a Novel Hybrid Interconnect Technology for the End of Roadmap

(2014) Chenyun Pan et al.   IEEE ELECTRON DEVICE LETTERS

Failure of semiclassical models to describe resistivity of nanometric, polycrystalline tungsten films

(2014) Dooho Choi et al.   JOURNAL OF APPLIED PHYSICS

Evidence of enhanced electron-phonon coupling in ultrathin epitaxial copper films

(2013) Yukta P. Timalsina et al.   APPLIED PHYSICS LETTERS

Epitaxial Ag(001) grown on MgO(001) and TiN(001): Twinning, surface morphology, and electron surface scattering

(2012) J. S. Chawla et al.   JOURNAL OF APPLIED PHYSICS

Low-Resistivity 10 nm Diameter Magnetic Sensors

(2012) Mazin M. Maqableh et al.   NANO LETTERS

Gas-dependent bandgap and electrical conductivity of Cu2O thin films

(2012) Liangmin Zhang et al.   SOLAR ENERGY MATERIALS AND SOLAR CELLS

Resistivity of sub-50nm copper lines epitaxially grown on Si(100) substrate

(2012) Pei-I Wang et al.   THIN SOLID FILMS

Epitaxial TiN(001) wetting layer for growth of thin single-crystal Cu(001)

(2011) J. S. Chawla et al.   JOURNAL OF APPLIED PHYSICS

Electron scattering at surfaces and grain boundaries in Cu thin films and wires

(2011) J. S. Chawla et al.   PHYSICAL REVIEW B

Resistivity dominated by surface scattering in sub-50 nm Cu wires

(2010) R. L. Graham et al.   APPLIED PHYSICS LETTERS

Effect of O2 adsorption on electron scattering at Cu(001) surfaces

(2010) J. S. Chawla et al.   APPLIED PHYSICS LETTERS

Resolving surface chemical states in XPS analysis of first row transition metals, oxides and hydroxides: Sc, Ti, V, Cu and Zn

(2010) Mark C. Biesinger et al.   APPLIED SURFACE SCIENCE

Resolving surface chemical states in XPS analysis of first row transition metals, oxides and hydroxides: Cr, Mn, Fe, Co and Ni

(2010) Mark C. Biesinger et al.   APPLIED SURFACE SCIENCE

Large Discrete Resistance Jump at Grain Boundary in Copper Nanowire

(2010) Tae-Hwan Kim et al.   NANO LETTERS

Surface and grain-boundary scattering in nanometric Cu films

(2010) Tik Sun et al.   PHYSICAL REVIEW B

Resistivity of thin Cu films coated with Ta, Ti, Ru, Al, and Pd barrier layers from first principles

(2010) Ferdows Zahid et al.   PHYSICAL REVIEW B

Size-Dependent Resistivity in Nanoscale Interconnects

(2009) Daniel Josell et al.   Annual Review of Materials Research

Specular electron scattering at single-crystal Cu(001) surfaces

(2009) J. S. Chawla et al.   APPLIED PHYSICS LETTERS

Direct detection of grain boundary scattering in damascene Cu wires by nanoscale four-point probe resistance measurements

(2009) Yusuke Kitaoka et al.   APPLIED PHYSICS LETTERS

Influence of Titanium Liner on Resistivity of Copper Interconnects

(2009) Hideki Kitada et al.   JAPANESE JOURNAL OF APPLIED PHYSICS

Dominant role of grain boundary scattering in the resistivity of nanometric Cu films

(2009) Tik Sun et al.   PHYSICAL REVIEW B

Resistivity of thin Cu films with surface roughness

(2009) Youqi Ke et al.   PHYSICAL REVIEW B

X-ray photoelectron spectroscopic chemical state quantification of mixed nickel metal, oxide and hydroxide systems

(2009) Mark C. Biesinger et al.   SURFACE AND INTERFACE ANALYSIS

The influence of surface roughness on electrical conductance of thin Cu films: An ab initio study

(2008) V. Timoshevskii et al.   JOURNAL OF APPLIED PHYSICS