The Polishing Effect of SiC Substrates in Femtosecond Laser Irradiation Assisted Chemical Mechanical Polishing (CMP)

标题
The Polishing Effect of SiC Substrates in Femtosecond Laser Irradiation Assisted Chemical Mechanical Polishing (CMP)
作者
关键词
-
出版物
ECS Journal of Solid State Science and Technology
Volume 6, Issue 4, Pages P105-P112
出版商
The Electrochemical Society
发表日期
2017-01-27
DOI
10.1149/2.0041704jss

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