The Polishing Effect of SiC Substrates in Femtosecond Laser Irradiation Assisted Chemical Mechanical Polishing (CMP)
出版年份 2017 全文链接
标题
The Polishing Effect of SiC Substrates in Femtosecond Laser Irradiation Assisted Chemical Mechanical Polishing (CMP)
作者
关键词
-
出版物
ECS Journal of Solid State Science and Technology
Volume 6, Issue 4, Pages P105-P112
出版商
The Electrochemical Society
发表日期
2017-01-27
DOI
10.1149/2.0041704jss
参考文献
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注意:仅列出部分参考文献,下载原文获取全部文献信息。- Smart Polishing of Hard-to-Machine Materials with an Innovative Dilatancy Pad under High-Pressure, High-Speed, Immersed Condition
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