标题
Investigation of Thermal Creep in Metal-Based MEMS Cantilevers
作者
关键词
-
出版物
JOURNAL OF MICROELECTROMECHANICAL SYSTEMS
Volume 32, Issue 5, Pages 474-482
出版商
Institute of Electrical and Electronics Engineers (IEEE)
发表日期
2023-08-04
DOI
10.1109/jmems.2023.3298958
参考文献
相关参考文献
注意：仅列出部分参考文献，下载原文获取全部文献信息。- Modeling and Measurement of Thermal–Mechanical-Stress-Creep Effect for RF MEMS Switch Up to 200 °C
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