Recent progress in conductive electrospun materials for flexible electronics: Energy, sensing, and electromagnetic shielding applications

标题
Recent progress in conductive electrospun materials for flexible electronics: Energy, sensing, and electromagnetic shielding applications
作者
关键词
-
出版物
CHEMICAL ENGINEERING JOURNAL
Volume 465, Issue -, Pages 142847
出版商
Elsevier BV
发表日期
2023-04-10
DOI
10.1016/j.cej.2023.142847

向作者/读者发起求助以获取更多资源

Find the ideal target journal for your manuscript

Explore over 38,000 international journals covering a vast array of academic fields.

Search

Ask a Question. Answer a Question.

Quickly pose questions to the entire community. Debate answers and get clarity on the most important issues facing researchers.

Get Started