High performance epoxy resin with efficient electromagnetic wave absorption and heat dissipation properties for electron packaging by modification of 3D MDCF@hBN
出版年份 2022 全文链接
标题
High performance epoxy resin with efficient electromagnetic wave absorption and heat dissipation properties for electron packaging by modification of 3D MDCF@hBN
作者
关键词
-
出版物
CHEMICAL ENGINEERING JOURNAL
Volume 441, Issue -, Pages 136033
出版商
Elsevier BV
发表日期
2022-03-26
DOI
10.1016/j.cej.2022.136033
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