Novel micro-nano epoxy composites for electronic packaging application: Balance of thermal conductivity and processability
出版年份 2021 全文链接
标题
Novel micro-nano epoxy composites for electronic packaging application: Balance of thermal conductivity and processability
作者
关键词
A. Functional composites, B. Thermal properties, B. Mechanical properties, D. Rheology
出版物
COMPOSITES SCIENCE AND TECHNOLOGY
Volume 209, Issue -, Pages 108760
出版商
Elsevier BV
发表日期
2021-03-27
DOI
10.1016/j.compscitech.2021.108760
参考文献
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