Novel micro-nano epoxy composites for electronic packaging application: Balance of thermal conductivity and processability

标题
Novel micro-nano epoxy composites for electronic packaging application: Balance of thermal conductivity and processability
作者
关键词
A. Functional composites, B. Thermal properties, B. Mechanical properties, D. Rheology
出版物
COMPOSITES SCIENCE AND TECHNOLOGY
Volume 209, Issue -, Pages 108760
出版商
Elsevier BV
发表日期
2021-03-27
DOI
10.1016/j.compscitech.2021.108760

向作者/读者发起求助以获取更多资源

Reprint

联系作者

Find Funding. Review Successful Grants.

Explore over 25,000 new funding opportunities and over 6,000,000 successful grants.

Explore

Discover Peeref hubs

Discuss science. Find collaborators. Network.

Join a conversation