Modeling of the removal mechanism of monocrystalline silicon-based on phase change-dislocation theory and its edge chipping damage during micro-grinding

标题
Modeling of the removal mechanism of monocrystalline silicon-based on phase change-dislocation theory and its edge chipping damage during micro-grinding
作者
关键词
Micro-grinding, Monocrystalline silicon, Edge chipping, Evaluation factor
出版商
Elsevier BV
发表日期
2021-03-18
DOI
10.1016/j.precisioneng.2021.03.001

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