IMC microstructure modification and mechanical reinforcement of Sn–Ag–Cu/Cu microelectronic joints through an advanced surface finish technique
出版年份 2021 全文链接
标题
IMC microstructure modification and mechanical reinforcement of Sn–Ag–Cu/Cu microelectronic joints through an advanced surface finish technique
作者
关键词
Cu, Surface finish, IGEPIG, IMC, Molten solder channel, HSBS
出版物
Journal of Materials Research and Technology-JMR&T
Volume 11, Issue -, Pages 1895-1910
出版商
Elsevier BV
发表日期
2021-02-16
DOI
10.1016/j.jmrt.2021.02.029
参考文献
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