Wafer-level integration of self-aligned high aspect ratio silicon 3D structures using the MACE method with Au, Pd, Pt, Cu, and Ir

标题
Wafer-level integration of self-aligned high aspect ratio silicon 3D structures using the MACE method with Au, Pd, Pt, Cu, and Ir
作者
关键词
-
出版物
Beilstein Journal of Nanotechnology
Volume 11, Issue -, Pages 1439-1449
出版商
Beilstein Institut
发表日期
2020-09-23
DOI
10.3762/bjnano.11.128

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