Opportunities and challenges of 2D materials in back-end-of-line interconnect scaling
出版年份 2020 全文链接
标题
Opportunities and challenges of 2D materials in back-end-of-line interconnect scaling
作者
关键词
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出版物
JOURNAL OF APPLIED PHYSICS
Volume 128, Issue 8, Pages 080903
出版商
AIP Publishing
发表日期
2020-08-27
DOI
10.1063/5.0013737
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