Effects of the surface roughness on wetting properties and interfacial reactions between SAC305 solder and Cu substrate with Ni–W–P coating
出版年份 2020 全文链接
标题
Effects of the surface roughness on wetting properties and interfacial reactions between SAC305 solder and Cu substrate with Ni–W–P coating
作者
关键词
-
出版物
JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS
Volume -, Issue -, Pages -
出版商
Springer Science and Business Media LLC
发表日期
2020-07-28
DOI
10.1007/s10854-020-04072-5
参考文献
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