Effect of metal buffer layer on the thermal interface performance of liquid metal alloy on copper plate
出版年份 2019 全文链接
标题
Effect of metal buffer layer on the thermal interface performance of liquid metal alloy on copper plate
作者
关键词
-
出版物
JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS
Volume 30, Issue 16, Pages 15766-15771
出版商
Springer Science and Business Media LLC
发表日期
2019-08-02
DOI
10.1007/s10854-019-01962-1
参考文献
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