Thermal Conductivity Enhancement of Soft Polymer Composites through Magnetically Induced Percolation and Particle–Particle Contact Engineering

标题
Thermal Conductivity Enhancement of Soft Polymer Composites through Magnetically Induced Percolation and Particle–Particle Contact Engineering
作者
关键词
-
出版物
Advanced Materials Interfaces
Volume 6, Issue 6, Pages 1801857
出版商
Wiley
发表日期
2019-01-31
DOI
10.1002/admi.201801857

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