Annealing Temperature-Dependent Interfacial Behavior of Sequentially Plasma-Activated Silicon Bonded Wafers

标题
Annealing Temperature-Dependent Interfacial Behavior of Sequentially Plasma-Activated Silicon Bonded Wafers
作者
关键词
-
出版物
JOURNAL OF MICROELECTROMECHANICAL SYSTEMS
Volume 20, Issue 1, Pages 17-20
出版商
Institute of Electrical and Electronics Engineers (IEEE)
发表日期
2010-12-01
DOI
10.1109/jmems.2010.2090502

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