Copper reduction and atomic layer deposition by oxidative decomposition of formate by hydrazine

Deposition of Copper by Plasma-Enhanced Atomic Layer Deposition Using a Novel N-Heterocyclic Carbene Precursor

(2013) Jason P. Coyle et al.   CHEMISTRY OF MATERIALS

Precursors and chemistry for the atomic layer deposition of metallic first row transition metal films

(2013) Thomas J. Knisley et al.   COORDINATION CHEMISTRY REVIEWS

Mechanism for the Atomic Layer Deposition of Copper Using Diethylzinc as the Reducing Agent: A Density Functional Theory Study Using Gas-Phase Molecules as a Model

(2012) Gangotri Dey et al.   JOURNAL OF PHYSICAL CHEMISTRY A

Low Temperature Growth of High Purity, Low Resistivity Copper Films by Atomic Layer Deposition

(2011) Thomas J. Knisley et al.   CHEMISTRY OF MATERIALS

Hot-wire-assisted atomic layer deposition of a high quality cobalt film using cobaltocene: Elementary reaction analysis on NHx radical formation

(2011) Hideharu Shimizu et al.   JOURNAL OF VACUUM SCIENCE & TECHNOLOGY A

Relativistic effects in atomic and molecular properties

(2010) Miroslav Iliaš et al.   ACTA PHYSICA SLOVACA

Solution Reactions of a Bis(pyrrolylaldiminate)copper(II) Complex with Peralkyl Zinc, Aluminum, and Boron Reagents: Investigation of the Pathways Responsible for Copper Metal Deposition

(2010) Balamurugan Vidjayacoumar et al.   CHEMISTRY OF MATERIALS

Investigation of AlMe3, BEt3, and ZnEt2as Co-Reagents for Low-Temperature Copper Metal ALD/Pulsed-CVD

(2010) Balamurugan Vidjayacoumar et al.   CHEMISTRY OF MATERIALS

Thermal stability of copper nitride thin films: The role of nitrogen migration

(2010) R. Gonzalez-Arrabal et al.   JOURNAL OF APPLIED PHYSICS

Characterization of ALD copper thin films on palladium seed layers

(2009) Irene J. Hsu et al.   JOURNAL OF VACUUM SCIENCE & TECHNOLOGY A

Orientation of individualC60molecules adsorbed on Cu(111): Low-temperature scanning tunneling microscopy and density functional calculations

(2008) J. Andreas Larsson et al.   PHYSICAL REVIEW B

Vapor phase deposition of copper films with a Cu(I) β-diketiminate precursor

(2008) Jeffery S. Thompson et al.   THIN SOLID FILMS