Low Temperature Growth of High Purity, Low Resistivity Copper Films by Atomic Layer Deposition

标题
Low Temperature Growth of High Purity, Low Resistivity Copper Films by Atomic Layer Deposition
作者
关键词
-
出版物
CHEMISTRY OF MATERIALS
Volume 23, Issue 20, Pages 4417-4419
出版商
American Chemical Society (ACS)
发表日期
2011-09-28
DOI
10.1021/cm202475e

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