标题
Carbon-Nanotube Through-Silicon Via Interconnects for Three-Dimensional Integration
作者
关键词
-
出版物
Small
Volume 7, Issue 16, Pages 2313-2317
出版商
Wiley
发表日期
2011-06-21
DOI
10.1002/smll.201100615
参考文献
相关参考文献
注意:仅列出部分参考文献,下载原文获取全部文献信息。- Growth of Ultrahigh Density Vertically Aligned Carbon Nanotube Forests for Interconnects
- (2010) Santiago Esconjauregui et al. ACS Nano
- Ultrafast Transfer of Metal-Enhanced Carbon Nanotubes at Low Temperature for Large-Scale Electronics Assembly
- (2010) Yifeng Fu et al. ADVANCED MATERIALS
- Contact resistance between metal and carbon nanotube interconnects: Effect of work function and wettability
- (2010) Seong Chu Lim et al. APPLIED PHYSICS LETTERS
- Contact resistance of flexible, transparent carbon nanotube films with metals
- (2010) Hua Xu et al. APPLIED PHYSICS LETTERS
- Dry densification of carbon nanotube bundles
- (2010) Teng Wang et al. CARBON
- Is 3D chip technology the next growth engine for performance improvement?
- (2010) P. G. Emma et al. IBM JOURNAL OF RESEARCH AND DEVELOPMENT
- Compact AC Modeling and Performance Analysis of Through-Silicon Vias in 3-D ICs
- (2010) Chuan Xu et al. IEEE TRANSACTIONS ON ELECTRON DEVICES
- Application of through silicon via technology forin situtemperature monitoring on thermal interfaces
- (2010) Yifeng Fu et al. JOURNAL OF MICROMECHANICS AND MICROENGINEERING
- Carbon Nanotubes for VLSI: Interconnect and Transistor Applications
- (2010) Yuji Awano et al. PROCEEDINGS OF THE IEEE
- Formation and assembly of carbon nanotube bumps for interconnection applications
- (2009) K.P. Yung et al. DIAMOND AND RELATED MATERIALS
- Process Integration Considerations for 300 mm TSV Manufacturing
- (2009) S. Ramaswami et al. IEEE TRANSACTIONS ON DEVICE AND MATERIALS RELIABILITY
- Joule heating in single-walled carbon nanotubes
- (2009) Tarek Ragab et al. JOURNAL OF APPLIED PHYSICS
- 3D-LSI technology for image sensor
- (2009) Makoto Motoyoshi et al. Journal of Instrumentation
- Electrical Connectivity in Single-Walled Carbon Nanotube Networks
- (2009) Peter N. Nirmalraj et al. NANO LETTERS
- Through silicon vias filled with planarized carbon nanotube bundles
- (2009) Teng Wang et al. NANOTECHNOLOGY
- High-Density Through Silicon Vias for 3-D LSIs
- (2009) Mitsumasa Koyanagi et al. PROCEEDINGS OF THE IEEE
- 3-D Hyperintegration and Packaging Technologies for Micro-Nano Systems
- (2009) Jian-Qiang Lu PROCEEDINGS OF THE IEEE
- Flexible Carbon-Nanofiber Connectors with Anisotropic Adhesion Properties
- (2009) Hyunhyub Ko et al. Small
- Tungsten Through-Silicon Via Technology for Three-Dimensional LSIs
- (2008) Hirokazu Kikuchi et al. JAPANESE JOURNAL OF APPLIED PHYSICS
- A study of thermo-mechanical stress and its impact on through-silicon vias
- (2008) N Ranganathan et al. JOURNAL OF MICROMECHANICS AND MICROENGINEERING
- Carbon Nanotube Arrays with Strong Shear Binding-On and Easy Normal Lifting-Off
- (2008) L. Qu et al. SCIENCE
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