Application of through silicon via technology forin situtemperature monitoring on thermal interfaces

标题
Application of through silicon via technology forin situtemperature monitoring on thermal interfaces
作者
关键词
-
出版物
JOURNAL OF MICROMECHANICS AND MICROENGINEERING
Volume 20, Issue 2, Pages 025027
出版商
IOP Publishing
发表日期
2010-01-23
DOI
10.1088/0960-1317/20/2/025027

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