Barrier layer thickness analysis for reliable copper plug process in CMOS technology

出版年份 2011 全文链接

标题

Barrier layer thickness analysis for reliable copper plug process in CMOS technology

作者

关键词

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出版物

MICROELECTRONICS RELIABILITY

Volume 51, Issue 8, Pages 1365-1371

出版商

Elsevier BV

发表日期

2011-04-15

DOI

10.1016/j.microrel.2011.03.005

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