Effects of Hydrogen Plasma Treatments on the Atomic Layer Deposition of Copper

标题
Effects of Hydrogen Plasma Treatments on the Atomic Layer Deposition of Copper
作者
关键词
-
出版物
ELECTROCHEMICAL AND SOLID STATE LETTERS
Volume 11, Issue 5, Pages H107
出版商
The Electrochemical Society
发表日期
2008-03-15
DOI
10.1149/1.2844207

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