Modelling and validation of air damping in perforated gold and silicon MEMS plates

标题
Modelling and validation of air damping in perforated gold and silicon MEMS plates
作者
关键词
-
出版物
JOURNAL OF MICROMECHANICS AND MICROENGINEERING
Volume 20, Issue 1, Pages 015010
出版商
IOP Publishing
发表日期
2009-11-28
DOI
10.1088/0960-1317/20/1/015010

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