Thermal stress driven Sn whisker growth: in air and in vacuum

Least lead addition to mitigate tin whisker for ambient storage

(2013) Jung-Lae Jo et al.   JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS

Altering the Mechanical Properties of Sn Films by Alloying with Bi: Mimicking the Effect of Pb to Suppress Whiskers

(2012) Nitin Jadhav et al.   JOURNAL OF ELECTRONIC MATERIALS

Sn whisker growth during thermal cycling

(2011) Katsuaki Suganuma et al.   ACTA MATERIALIA

Effect of layer properties on stress evolution, intermetallic volume, and density during tin whisker formation

(2011) Eric Chason et al.   JOM

Whisker Growth Behavior of Sn and Sn Alloy Lead-Free Finishes

(2011) Alongheng Baated et al.   JOURNAL OF ELECTRONIC MATERIALS

Stress behavior of electroplated Sn films during thermal cycling

(2009) Jae Wook Shin et al.   JOURNAL OF MATERIALS RESEARCH

Growth of tin whiskers for lead-free plated leadframe packages in high humid environments and during thermal cycling

(2008) Yoshikuni Nakadaira et al.   MICROELECTRONICS RELIABILITY