Monoatomic layer removal mechanism in chemical mechanical polishing process: A molecular dynamics study

Investigation of material removal mechanism of silicon wafer in the chemical mechanical polishing process using molecular dynamics simulation method

(2009) Xuesong Han et al.   APPLIED PHYSICS A-MATERIALS SCIENCE & PROCESSING

Inhibitors for organic phosphonic acid system abrasive free polishing of Cu

(2008) Zhang Wei et al.   APPLIED SURFACE SCIENCE

Extrusion formation mechanism on silicon surface under the silica cluster impact studied by molecular dynamics simulation

(2008) Ruling Chen et al.   JOURNAL OF APPLIED PHYSICS

Energy transfer under impact load studied by molecular dynamics simulation

(2008) Ruling Chen et al.   JOURNAL OF NANOPARTICLE RESEARCH

A study of the estimation method of the cutting force for a conical tool under nanoscale depth of cut by molecular dynamics

(2008) Zone-Ching Lin et al.   NANOTECHNOLOGY

Damage-free polishing of monocrystalline silicon wafers without chemical additives

(2008) A.Q. Biddut et al.   SCRIPTA MATERIALIA

Effect of Nanoparticle Impact on Material Removal

(2008) Xuefeng Xu et al.   TRIBOLOGY TRANSACTIONS

Research on the molecular scale material removal mechanism in chemical mechanical polishing

(2008) YongGuang Wang et al.   Science Bulletin

Characteristics of silicon substrates fabricated using nanogrinding and chemo-mechanical-grinding

(2007) H. Huang et al.   MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING