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期刊名
Vacuum
VACUUM
ISSN / eISSN
0042-207X / 1879-2715
目标和范围
Vacuum is an international rapid publications journal with a focus on short communication. All papers are peer-reviewed, with the review process for short communication geared towards very fast turnaround times. The journal also published full research papers, thematic issues and selected papers from leading conferences.
A report in Vacuum should represent a major advance in an area that involves a controlled environment at pressures of one atmosphere or below.
The scope of the journal includes:
1. Vacuum; original developments in vacuum pumping and instrumentation, vacuum measurement, vacuum gas dynamics, gas-surface interactions, surface treatment for UHV applications and low outgassing, vacuum melting, sintering, and vacuum metrology. Technology and solutions for large-scale facilities (e.g., particle accelerators and fusion devices). New instrumentation ( e.g., detectors and electron microscopes).
2. Plasma science; advances in PVD, CVD, plasma-assisted CVD, ion sources, deposition processes and analysis.
3. Surface science; surface engineering, surface chemistry, surface analysis, crystal growth, ion-surface interactions and etching, nanometer-scale processing, surface modification.
4. Materials science; novel functional or structural materials. Metals, ceramics, and polymers. Experiments, simulations, and modelling for understanding structure-property relationships. Thin films and coatings. Nanostructures and ion implantation.
A report in Vacuum should represent a major advance in an area that involves a controlled environment at pressures of one atmosphere or below.
The scope of the journal includes:
1. Vacuum; original developments in vacuum pumping and instrumentation, vacuum measurement, vacuum gas dynamics, gas-surface interactions, surface treatment for UHV applications and low outgassing, vacuum melting, sintering, and vacuum metrology. Technology and solutions for large-scale facilities (e.g., particle accelerators and fusion devices). New instrumentation ( e.g., detectors and electron microscopes).
2. Plasma science; advances in PVD, CVD, plasma-assisted CVD, ion sources, deposition processes and analysis.
3. Surface science; surface engineering, surface chemistry, surface analysis, crystal growth, ion-surface interactions and etching, nanometer-scale processing, surface modification.
4. Materials science; novel functional or structural materials. Metals, ceramics, and polymers. Experiments, simulations, and modelling for understanding structure-property relationships. Thin films and coatings. Nanostructures and ion implantation.
研究方向
物理:应用
材料科学:综合
CiteScore
7.00
查看趋势图
CiteScore 学科排名
类别 | 分区 | 排名 |
---|---|---|
Physics and Astronomy - Instrumentation | Q1 | #16/136 |
Physics and Astronomy - Condensed Matter Physics | Q1 | #70/423 |
Physics and Astronomy - Surfaces, Coatings and Films | Q1 | #29/131 |
Web of Science 核心合集
Science Citation Index Expanded (SCIE) | Social Sciences Citation Index (SSCI) |
---|---|
Indexed | - |
类别 (Journal Citation Reports 2023) | 分区 |
---|---|
MATERIALS SCIENCE, MULTIDISCIPLINARY - SCIE | Q2 |
PHYSICS, APPLIED - SCIE | Q2 |
H-index
75
出版国家或地区
ENGLAND
出版商
Elsevier Ltd
出版周期
Monthly
出版年份
1951
年文章数
781
Open Access
NO
通讯方式
PERGAMON-ELSEVIER SCIENCE LTD, THE BOULEVARD, LANGFORD LANE, KIDLINGTON, OXFORD, ENGLAND, OX5 1GB
认证评论
Submitted on June 3rd, 2022;
Under review on June 5th, 2022;
Major revision requested on July 10th, 2022;
Due to some reasons, I intentionally delayed the submission. Each time I received the major revision, the review process was very fast. Pay close attention to the issue of charge reference. Accepted on November 27th, 2022. It took nearly 6 months, so go for it! Good luck to everyone!
2022.05.26: Submitted
2022.05.26: Under review by the editor
2022.05.27: Major review
2022.06.15: Revised, under review by the editor
2022.06.20: Minor revision
2022.06.26: Revised, the editor requested re-correction of XPS data
2022.07.10: Revised
2022.07.13: Under review by the editor
2022.07.17: The reviewer raised 3 questions regarding the XPS and UPS experiments, and the editor requested major revisions
2022.07.22: Revised, under review by the editor
2022.07.25: Revised, accepted
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