Grain boundary passivation studied by in situ scanning tunneling microscopy on microcrystalline copper

In situ scanning tunneling microscopy study of the intergranular corrosion of copper

(2014) E. Martinez-Lombardia et al.   ELECTROCHEMISTRY COMMUNICATIONS

In Situ Scanning Tunneling Microscopy Study of Grain-Dependent Corrosion on Microcrystalline Copper

(2014) Esther Martinez-Lombardia et al.   Journal of Physical Chemistry C

Role of Nanostructure in Electrochemical Corrosion and High Temperature Oxidation: A Review

(2014) B. V. Mahesh et al.   METALLURGICAL AND MATERIALS TRANSACTIONS A-PHYSICAL METALLURGY AND MATERIALS SCIENCE

Scanning electrochemical microscopy to study the effect of crystallographic orientation on the electrochemical activity of pure copper

(2013) E. Martinez-Lombardia et al.   ELECTROCHIMICA ACTA

Structural dependence of gold deposition by nanoplating in polycrystalline copper

(2013) L. Lapeire et al.   JOURNAL OF MATERIALS SCIENCE

Effect of grain size changes on corrosion behavior of copper produced by accumulative roll bonding process

(2013) A. Nikfahm et al.   Materials Research-Ibero-american Journal of Materials

Effect of neighboring grains on the microscopic corrosion behavior of a grain in polycrystalline copper

(2012) L. Lapeire et al.   CORROSION SCIENCE

Structure and Morphology Modifications of Silver Surface in the Early Stages of Sulfide Growth in Alkaline Solution

(2012) Ning Li et al.   Journal of Physical Chemistry C

Improving the intergranular corrosion resistance of 304 stainless steel by grain boundary network control

(2011) Changliang Hu et al.   CORROSION SCIENCE

A comparison between the corrosion behavior of nanostructured copper thin films deposited on oxidized silicon and copper sheet in alkaline media

(2010) M. Yeganeh et al.   SURFACE & COATINGS TECHNOLOGY

The effect of crystallographic orientation on the active corrosion of pure magnesium

(2007) Ming Liu et al.   SCRIPTA MATERIALIA