An intelligent system for wafer bin map defect diagnosis: An empirical study for semiconductor manufacturing

标题
An intelligent system for wafer bin map defect diagnosis: An empirical study for semiconductor manufacturing
作者
关键词
-
出版物
ENGINEERING APPLICATIONS OF ARTIFICIAL INTELLIGENCE
Volume 26, Issue 5-6, Pages 1479-1486
出版商
Elsevier BV
发表日期
2012-12-24
DOI
10.1016/j.engappai.2012.11.009

向作者/读者发起求助以获取更多资源

Find Funding. Review Successful Grants.

Explore over 25,000 new funding opportunities and over 6,000,000 successful grants.

Explore

Discover Peeref hubs

Discuss science. Find collaborators. Network.

Join a conversation