Metal seed layer sputtering on high aspect ratio through-silicon-vias for copper filling electroplating

标题
Metal seed layer sputtering on high aspect ratio through-silicon-vias for copper filling electroplating
作者
关键词
-
出版物
ELECTROCHIMICA ACTA
Volume 114, Issue -, Pages 832-837
出版商
Elsevier BV
发表日期
2013-10-11
DOI
10.1016/j.electacta.2013.09.096

向作者/读者发起求助以获取更多资源

Become a Peeref-certified reviewer

The Peeref Institute provides free reviewer training that teaches the core competencies of the academic peer review process.

Get Started

Ask a Question. Answer a Question.

Quickly pose questions to the entire community. Debate answers and get clarity on the most important issues facing researchers.

Get Started