Influence of the substrate's surface structure on the mechanism and kinetics of the electrochemical UPD formation of a copper monolayer on gold

出版年份 2011 全文链接

标题

作者

关键词

出版物

Volume 56, Issue 27, Pages 10083-10092

出版商

Elsevier BV

发表日期

2011-09-07

DOI

10.1016/j.electacta.2011.08.105

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