Stress Adjustment and Bonding of H-Implanted 2 in. Freestanding GaN Wafer: The Concept of Double-Sided Splitting

出版年份 2009 全文链接

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作者

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出版物

ELECTROCHEMICAL AND SOLID STATE LETTERS

Volume 12, Issue 4, Pages H105

出版商

The Electrochemical Society

发表日期

2009-02-13

DOI

10.1149/1.3066081

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