Investigation on constitution of electrical conductive adhesives fitting for UV–thermal dual curing

Preparation and adhesive performance of electrical conductive epoxy-acrylate resin containing silver-plated graphene

(2014) Shuo Dou et al.   JOURNAL OF ADHESION SCIENCE AND TECHNOLOGY

Study on the properties of conductive adhesives in various curing manners for MCM applications

(2014) Hong Gao et al.   JOURNAL OF ADHESION SCIENCE AND TECHNOLOGY

Electrical property improvement of dicyandiamide-cured electrically conductive adhesives through in-situ replacement by difunctional acids and the impact on storage

(2013) Ling Wang et al.   INTERNATIONAL JOURNAL OF ADHESION AND ADHESIVES

Preparation and characterization of antistatic coatings with modified BaTiO3powders as conductive fillers

(2013) Qingyan Shang et al.   JOURNAL OF ADHESION SCIENCE AND TECHNOLOGY

Novel acrylic pressure-sensitive adhesive (PSA) containing silver particles

(2012) Zbigniew Czech et al.   JOURNAL OF ADHESION SCIENCE AND TECHNOLOGY

UV intensity, temperature and dark-curing effects in cationic photo-polymerization of a cycloaliphatic epoxy resin

(2012) B. Golaz et al.   POLYMER

Dual-curing behavior and scratch characteristics of hydroxyl functionalized urethane methacrylate oligomer for automotive clearcoats

(2012) Seung M. Noh et al.   PROGRESS IN ORGANIC COATINGS

Comparison of new conductive adhesives based on silver and carbon nanotubes for solar cells interconnection

(2012) Y. Zemen et al.   SOLAR ENERGY MATERIALS AND SOLAR CELLS

Highly Reliable Copper-Based Conductive Adhesives Using an Amine Curing Agent for in Situ Oxidation/Corrosion Prevention

(2011) Rongwei Zhang et al.   IEEE Transactions on Components Packaging and Manufacturing Technology

Highly reliable, low cost, isotropically conductive adhesives filled with Ag-coated Cu flakes for electronic packaging applications

(2010) Rongwei Zhang et al.   INTERNATIONAL JOURNAL OF ADHESION AND ADHESIVES

Study on the curing process and shearing tests of die attachment by Ag-epoxy electrically conductive adhesive

(2009) Youliang Guan et al.   INTERNATIONAL JOURNAL OF ADHESION AND ADHESIVES

Effects of Trace Elements in Copper Fillers on the Electrical Properties of Conductive Adhesives

(2009) Li-Ngee Ho et al.   JOURNAL OF ELECTRONIC MATERIALS

Recent advances in isotropic conductive adhesives for electronics packaging applications

(2007) Irfan Mir et al.   INTERNATIONAL JOURNAL OF ADHESION AND ADHESIVES