Effects of Trace Elements in Copper Fillers on the Electrical Properties of Conductive Adhesives

标题
Effects of Trace Elements in Copper Fillers on the Electrical Properties of Conductive Adhesives
作者
关键词
-
出版物
JOURNAL OF ELECTRONIC MATERIALS
Volume 39, Issue 1, Pages 115-123
出版商
Springer Nature
发表日期
2009-09-24
DOI
10.1007/s11664-009-0946-5

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