A numerical study of residual stress induced in machined silicon surfaces by molecular dynamics simulation

Effects of water molecules on tribological behavior and property measurements in nano-indentation processes - a numerical analysis

(2013) Yachao Wang et al.   Nanoscale Research Letters

Effect of tensile residual stresses on fatigue crack growth and S–N curves in tubular joints loaded in compression

(2011) C. Acevedo et al.   INTERNATIONAL JOURNAL OF FATIGUE

Modeling and Optimal Design of Machining-Induced Residual Stresses in Aluminium Alloys Using a Fast Hierarchical Multiobjective Optimization Algorithm

(2011) Qian Zhang et al.   MATERIALS AND MANUFACTURING PROCESSES

Prediction of residual stress distributions due to surface machining and welding and crack growth simulation under residual stress distribution

(2011) Ryohei Ihara et al.   NUCLEAR ENGINEERING AND DESIGN

Residual stress analysis on silicon wafer surface layers induced by ultra-precision grinding

(2011) Yinxia Zhang et al.   RARE METALS

Evaluation of a three-dimensional single-point turning at atomistic level by a molecular dynamic simulation

(2010) Jing Shi et al.   INTERNATIONAL JOURNAL OF ADVANCED MANUFACTURING TECHNOLOGY

Investigation of material removal mechanism of silicon wafer in the chemical mechanical polishing process using molecular dynamics simulation method

(2009) Xuesong Han et al.   APPLIED PHYSICS A-MATERIALS SCIENCE & PROCESSING

A molecular dynamics study of phase transformations in mono-crystalline Si under nanoindentation

(2008) Yen-Hung Lin et al.   APPLIED PHYSICS A-MATERIALS SCIENCE & PROCESSING

Phase transformation and residual stress probed by Raman spectroscopy in diamond-turned single crystal silicon

(2008) R G Jasinevicius et al.   PROCEEDINGS OF THE INSTITUTION OF MECHANICAL ENGINEERS PART B-JOURNAL OF ENGINEERING MANUFACTURE

The influence of different cutting speeds on the cutting force and strain–stress behaviors of single crystal copper during nano-scale orthogonal cutting

(2007) Zone-Ching Lin et al.   JOURNAL OF MATERIALS PROCESSING TECHNOLOGY

Nondestructive measurement of machining-induced amorphous layers in single-crystal silicon by laser micro-Raman spectroscopy

(2007) Jiwang Yan et al.   PRECISION ENGINEERING-JOURNAL OF THE INTERNATIONAL SOCIETIES FOR PRECISION ENGINEERING AND NANOTECHNOLOGY