Reliability analysis of vibrating electronic assemblies using analytical solutions and response surface methodology

出版年份 2018 全文链接

标题

作者

关键词

Analytical solutions, Reliability, Response surface methodology, Electronic packaging, Vibration loading

出版物

Volume 84, Issue -, Pages 238-247

出版商

Elsevier BV

发表日期

2018-04-07

DOI

10.1016/j.microrel.2018.03.029

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