Material removal of single crystal 4H-SiC wafers in hybrid laser-waterjet micromachining process

标题
Material removal of single crystal 4H-SiC wafers in hybrid laser-waterjet micromachining process
作者
关键词
-
出版物
MATERIALS SCIENCE IN SEMICONDUCTOR PROCESSING
Volume 82, Issue -, Pages 112-125
出版商
Elsevier BV
发表日期
2018-04-11
DOI
10.1016/j.mssp.2018.03.035

向作者/读者发起求助以获取更多资源

Discover Peeref hubs

Discuss science. Find collaborators. Network.

Join a conversation

Become a Peeref-certified reviewer

The Peeref Institute provides free reviewer training that teaches the core competencies of the academic peer review process.

Get Started