Selective adsorption of catalyst and copper plating for additive fabrication of conductive patterns and through-holes

出版年份 2015 全文链接

标题

作者

关键词

selective copper plating, additive fabrication, Patterning-Adsorption-Plating, through-holes, electroless plating

出版物

Volume 158, Issue -, Pages 7-12

出版商

Elsevier BV

发表日期

2015-01-29

DOI

10.1016/j.electacta.2015.01.161

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