Discrete phase method study of ball grid array underfill process using nano-silica filler-reinforced composite-encapsulant with varying filler loadings

标题
Discrete phase method study of ball grid array underfill process using nano-silica filler-reinforced composite-encapsulant with varying filler loadings
作者
关键词
Ball grid array (BGA), Discrete phase model (DPM), Electronic packaging, Nano-silica composite-encapsulant, Underfill encapsulation
出版物
MICROELECTRONICS RELIABILITY
Volume 72, Issue -, Pages 45-64
出版商
Elsevier BV
发表日期
2017-04-05
DOI
10.1016/j.microrel.2017.03.034

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