A scratching force model of diamond abrasive particles in wire sawing of single crystal SiC

标题
A scratching force model of diamond abrasive particles in wire sawing of single crystal SiC
作者
关键词
Nano scratching, Single crystal SiC, Wire sawing, Indentation size effect
出版物
MATERIALS SCIENCE IN SEMICONDUCTOR PROCESSING
Volume 68, Issue -, Pages 21-29
出版商
Elsevier BV
发表日期
2017-06-03
DOI
10.1016/j.mssp.2017.05.032

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