Photonic Packaging: Transforming Silicon Photonic Integrated Circuits into Photonic Devices
出版年份 2016 全文链接
标题
Photonic Packaging: Transforming Silicon Photonic Integrated Circuits into Photonic Devices
作者
关键词
-
出版物
Applied Sciences-Basel
Volume 6, Issue 12, Pages 426
出版商
MDPI AG
发表日期
2016-12-15
DOI
10.3390/app6120426
参考文献
相关参考文献
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