Mechanical and thermal characterization of a novel nanocomposite thermal interface material for electronic packaging

出版年份 2016 全文链接

标题

作者

关键词

Nano-TIM, Nano-fiber, Microelectronic packaging

出版物

Volume 56, Issue -, Pages 129-135

出版商

Elsevier BV

发表日期

2015-11-05

DOI

10.1016/j.microrel.2015.10.028

联系作者

Explore over 38,000 international journals covering a vast array of academic fields.

Interested in hosting your own webinar? Check the schedule and propose your idea to the Peeref Content Team.

Create Now