4.3 Article

Influence of channel length and high-K oxide thickness on subthreshold analog/RF performance of graded channel and gate stack DG-MOSFETs

期刊

MICROELECTRONICS RELIABILITY
卷 61, 期 -, 页码 24-29

出版社

PERGAMON-ELSEVIER SCIENCE LTD
DOI: 10.1016/j.microrel.2016.03.001

关键词

Graded channel gate stack; High-K oxide thickness; Analog performance; RF performance

资金

  1. Department of Science and Technology [SB/S3/EECE/067/2014]
  2. CSIR [90/096(770)/2013-EMR-I]
  3. AICTE [8-206/RIFD/RPS/POLICY-1/2014-15]
  4. Silicon Institute of Technology, Patia Hills, Bhubaneswar 751024, India

向作者/读者索取更多资源

In this paper, the graded channel gate stack (GCGS) DG MOSFET structure is studied in view of increasing device performance and immunity to short channel effects. The device has the advantage of improved gate oxide reliability, suppressed parasitic bipolar effect, lower DIBL and higher cut-off frequency. Therefore, the device must be investigated with respect to the variation of different structure dependent parameters before fabrication to have better reliability and constancy. In this work we have studied the device with respect to variation in high K oxide thickness (t(oxh)) and channel length (L-g) to have better understanding on variation of different analog/RF performance parameters. The results validate that variations in t(oxh) of the device significantly alters device performance parameters and must be pre accounted for realizing reliable analog/RF system on chip circuits. (C) 2016 Elsevier Ltd. All rights reserved.

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