Contributions of chemical interactions and mechanical interlocking for the adhesion of electroplated copper to ABS in the Cr(VI) etching process

标题
Contributions of chemical interactions and mechanical interlocking for the adhesion of electroplated copper to ABS in the Cr(VI) etching process
作者
关键词
-
出版物
INTERNATIONAL JOURNAL OF ADHESION AND ADHESIVES
Volume 126, Issue -, Pages 103450
出版商
Elsevier BV
发表日期
2023-07-14
DOI
10.1016/j.ijadhadh.2023.103450

向作者/读者发起求助以获取更多资源

Discover Peeref hubs

Discuss science. Find collaborators. Network.

Join a conversation

Become a Peeref-certified reviewer

The Peeref Institute provides free reviewer training that teaches the core competencies of the academic peer review process.

Get Started