Contributions of chemical interactions and mechanical interlocking for the adhesion of electroplated copper to ABS in the Cr(VI) etching process
出版年份 2023 全文链接
标题
Contributions of chemical interactions and mechanical interlocking for the adhesion of electroplated copper to ABS in the Cr(VI) etching process
作者
关键词
-
出版物
INTERNATIONAL JOURNAL OF ADHESION AND ADHESIVES
Volume 126, Issue -, Pages 103450
出版商
Elsevier BV
发表日期
2023-07-14
DOI
10.1016/j.ijadhadh.2023.103450
参考文献
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