Simulation and experimental validation of the interplay between dielectrophoretic and electroosmotic behavior of conductive and insulator particles for nanofabrication and lab-on-chip applications
出版年份 2023 全文链接
标题
Simulation and experimental validation of the interplay between dielectrophoretic and electroosmotic behavior of conductive and insulator particles for nanofabrication and lab-on-chip applications
作者
关键词
-
出版物
COLLOIDS AND SURFACES A-PHYSICOCHEMICAL AND ENGINEERING ASPECTS
Volume 663, Issue -, Pages 131065
出版商
Elsevier BV
发表日期
2023-02-02
DOI
10.1016/j.colsurfa.2023.131065
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