Bowing-alleviated continuous bandgap engineering of wafer-scale WS2xSe2(1-x) monolayer alloys and their assembly into hetero-multilayers
出版年份 2022 全文链接
标题
Bowing-alleviated continuous bandgap engineering of wafer-scale WS2xSe2(1-x) monolayer alloys and their assembly into hetero-multilayers
作者
关键词
-
出版物
NPG Asia Materials
Volume 14, Issue 1, Pages -
出版商
Springer Science and Business Media LLC
发表日期
2022-11-18
DOI
10.1038/s41427-022-00437-w
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