MXene fillers and silver flakes filled epoxy resin for new hybrid conductive adhesives
出版年份 2022 全文链接
标题
MXene fillers and silver flakes filled epoxy resin for new hybrid conductive adhesives
作者
关键词
-
出版物
CERAMICS INTERNATIONAL
Volume -, Issue -, Pages -
出版商
Elsevier BV
发表日期
2022-12-09
DOI
10.1016/j.ceramint.2022.12.055
参考文献
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注意:仅列出部分参考文献,下载原文获取全部文献信息。- Effects of silver nano-particles and nano-wires on properties of electrically conductive adhesives
- (2022) Hao Liu et al. MICROELECTRONICS RELIABILITY
- Two-Dimensional F-Ti3C2Tx@Ag Composite for an Extraordinary Long Cycle Lifetime with High Specific Capacity in an Aluminum Battery
- (2021) Xiaogeng Huo et al. ACS Applied Materials & Interfaces
- The synergistic effect of micron spherical and flaky silver-coated copper for conductive adhesives to achieve high electrical conductivity with low percolation threshold
- (2021) Weiwei Zhang et al. INTERNATIONAL JOURNAL OF ADHESION AND ADHESIVES
- Synthesis of carboxylated-silver nanowires: Electrical conductivity enhancement of isotropic conductive adhesives and long-term stability in a mixture of solvents
- (2021) S.M. Hosseini-Shahisavandi et al. ADVANCED POWDER TECHNOLOGY
- Facile and green fabrication of flame-retardant Ti3C2Tx MXene networks for ultrafast, reusable and weather-resistant fire warning
- (2021) Min Mao et al. CHEMICAL ENGINEERING JOURNAL
- Microstructure, resistivity, and shear strength of electrically conductive adhesives made of silver-coated copper powder
- (2021) Z. Sahebi Hamrah et al. MICROELECTRONICS RELIABILITY
- Facile preparation of self-assembled MXene@Au@CdS nanocomposite with enhanced photocatalytic hydrogen production activity
- (2020) Juanjuan Yin et al. Science China-Materials
- Ultra-low temperature curable nano-silver conductive adhesive for piezoelectric composite material
- (2018) Chao Yan et al. PHYSICA B-CONDENSED MATTER
- Fabrication of tunable hierarchical MXene@AuNPs nanocomposites constructed by self-reduction reactions with enhanced catalytic performances
- (2018) Kaikai Li et al. Science China-Materials
- Surface functionalization of micro silver flakes and their application in electrically conductive adhesives for electronic package
- (2013) Hui-Wang Cui et al. INTERNATIONAL JOURNAL OF ADHESION AND ADHESIVES
- Highly Conductive, Flexible, Polyurethane-Based Adhesives for Flexible and Printed Electronics
- (2012) Zhuo Li et al. ADVANCED FUNCTIONAL MATERIALS
- Investigation of Electrically Conductive Structural Adhesives using Nickel Nanostrands
- (2011) Nathan Hansen et al. JOURNAL OF ADHESION SCIENCE AND TECHNOLOGY
- Fabrication of highly conducting and transparent graphene films
- (2010) Shu Jun Wang et al. CARBON
- Effect of ultrasonication medium on the properties of copper nanoparticle-filled epoxy composite for electrical conductive adhesive (ECA) application
- (2009) K. L. Chan et al. JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS
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