Effect of ultrasonication medium on the properties of copper nanoparticle-filled epoxy composite for electrical conductive adhesive (ECA) application

标题
Effect of ultrasonication medium on the properties of copper nanoparticle-filled epoxy composite for electrical conductive adhesive (ECA) application
作者
关键词
-
出版物
出版商
Springer Nature
发表日期
2009-10-14
DOI
10.1007/s10854-009-9991-3

向作者/读者发起求助以获取更多资源

Create your own webinar

Interested in hosting your own webinar? Check the schedule and propose your idea to the Peeref Content Team.

Create Now

Become a Peeref-certified reviewer

The Peeref Institute provides free reviewer training that teaches the core competencies of the academic peer review process.

Get Started