Wetting and Interfacial Chemistry of Sn-Zn-Ga Alloys with Cu Substrate

Formation and growth of intermetallic phases at the interface in the Cu/ Sn–Zn–Ag–Cu /Cu joints

(2015) Tomasz Gancarz et al.   JOURNAL OF ALLOYS AND COMPOUNDS

Physical, Thermal, Mechanical Properties, and Microstructural Characterization of Sn-9Zn-XGa Alloys

(2015) Tomasz Gancarz   METALLURGICAL AND MATERIALS TRANSACTIONS A-PHYSICAL METALLURGY AND MATERIALS SCIENCE

Wetting and Interfacial Chemistry of SnZnCu Alloys with Cu and Al Substrates

(2014) Przemysław Fima et al.   JOURNAL OF MATERIALS ENGINEERING AND PERFORMANCE

Prediction of Intermetallic Compound Formation Sequences in Pseudo Binary Diffusion Couples: Experimental Examinations for (Sn-xZn)/Cu (x = 2, 5, 10, 15, 20 and 25 mass%) by a Kinetic Model with Thermodynamic Data Using MDR Diagram

(2014) Shinichi Terashima et al.   MATERIALS TRANSACTIONS

Thermal Expansion, Electrical Resistivity, and Spreading Area of Sn-Zn-In Alloys

(2013) Tomasz Gancarz et al.   JOURNAL OF MATERIALS ENGINEERING AND PERFORMANCE

Comparative thermodynamic analysis and phase diagram prediction of the Ga – Sn – Zn system

(2012) Dragana Živković et al.   International Journal of Materials Research

Properties and interfacial microstructure of Sn–Zn–Ga solder joint with rare earth Pr addition

(2012) Huan Ye et al.   MATERIALS & DESIGN

Retarding the Cu5Zn8 phase fracture at the Sn–9wt.% Zn/Cu interface

(2010) Jin-Yi Wang et al.   SCRIPTA MATERIALIA

Effect of Bi addition on the activation energy for the growth of Cu5Zn8 intermetallic in the Sn–Zn lead-free solder

(2009) Ramani Mayappan et al.   INTERMETALLICS

Wetting properties and interfacial microstructures of Sn–Zn–xGa solders on Cu substrate

(2009) WenXue Chen et al.   MATERIALS & DESIGN

Liquidus projection and thermodynamic modeling of Sn–Zn–Cu ternary system

(2008) Yu-chih Huang et al.   JOURNAL OF ALLOYS AND COMPOUNDS

Influence of Ga addition on Microstructure, Tensile Properties and Surface Oxide Film Characteristics of Microelectronic Sn-9Zn-xGa Solders

(2008) Fei-Yi Hung et al.   MATERIALS TRANSACTIONS