High-Precision Thickness Measurement of Cu Film on Si-Based Wafer Using Erasable Printed Eddy Current Coil and High-Sensitivity Associated Circuit Techniques
出版年份 2021 全文链接
标题
High-Precision Thickness Measurement of Cu Film on Si-Based Wafer Using Erasable Printed Eddy Current Coil and High-Sensitivity Associated Circuit Techniques
作者
关键词
-
出版物
IEEE TRANSACTIONS ON INDUSTRIAL ELECTRONICS
Volume 69, Issue 9, Pages 9556-9565
出版商
Institute of Electrical and Electronics Engineers (IEEE)
发表日期
2021-09-16
DOI
10.1109/tie.2021.3111570
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