Bubble Behavior and Its Effect on Surface Integrity in Laser-Induced Plasma Micro-Machining Silicon Wafer
出版年份 2022 全文链接
标题
Bubble Behavior and Its Effect on Surface Integrity in Laser-Induced Plasma Micro-Machining Silicon Wafer
作者
关键词
-
出版物
JOURNAL OF MANUFACTURING SCIENCE AND ENGINEERING-TRANSACTIONS OF THE ASME
Volume 144, Issue 9, Pages -
出版商
ASME International
发表日期
2022-04-25
DOI
10.1115/1.4054416
参考文献
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