Depth of cut for single abrasive and cutting force in resin bonded diamond wire sawing

Experimental study of the cutting performance of free-abrasive wire sawing in a magnetic field

(2016) Tengwei Qiu et al.   INTERNATIONAL JOURNAL OF ADVANCED MANUFACTURING TECHNOLOGY

Slicing parameters optimizing and experiments based on constant wire wear loss model in multi-wire saw

(2015) Z. Li et al.   INTERNATIONAL JOURNAL OF ADVANCED MANUFACTURING TECHNOLOGY

Investigation on diamond wire break-in and its effects on cutting performance in multi-wire sawing

(2015) Sangjik Lee et al.   INTERNATIONAL JOURNAL OF ADVANCED MANUFACTURING TECHNOLOGY

Distribution of diamond grains in fixed abrasive wire sawing process

(2014) Chunhui Chung et al.   INTERNATIONAL JOURNAL OF ADVANCED MANUFACTURING TECHNOLOGY

Numerical and experimental investigations of micromechanical processes during wire sawing

(2014) B. Nassauer et al.   INTERNATIONAL JOURNAL OF SOLIDS AND STRUCTURES

Discrete element simulation of micromechanical removal processes during wire sawing

(2013) T. Liedke et al.   WEAR

Analysis of ductile mode and brittle transition of AFM nanomachining of silicon

(2012) Seoung Hwan Lee   INTERNATIONAL JOURNAL OF MACHINE TOOLS & MANUFACTURE

Study of Ductile-to-Brittle Transition in Single Grit Diamond Scribing of Silicon: Application to Wire Sawing of Silicon Wafers

(2012) Hao Wu et al.   JOURNAL OF ENGINEERING MATERIALS AND TECHNOLOGY-TRANSACTIONS OF THE ASME

A macroscopic mechanical model of the wire sawing process

(2011) T. Liedke et al.   INTERNATIONAL JOURNAL OF MACHINE TOOLS & MANUFACTURE

Characterization of polycrystalline silicon wafers for solar cells sliced with novel fixed-abrasive wire

(2010) N. Watanabe et al.   PROGRESS IN PHOTOVOLTAICS

Mechanisms of wafer sawing and impact on wafer properties

(2010) A. Bidiville et al.   PROGRESS IN PHOTOVOLTAICS

Empirical modelling of grinding force based on multivariate analysis

(2007) Qiang Liu et al.   JOURNAL OF MATERIALS PROCESSING TECHNOLOGY